We provided invaluable support to our prominent networking client by meticulously analyzing the electrical characteristics of their Optical Communication IP. Our thorough screening process covered both the receiver and transmitter dies, all conveniently located on a single shuttle wafer. Our primary objective was to precisely characterize the Rx and Tx modules, ultimately optimizing test time efficiency during production.
The digital electrical characteristics of the Optical Communication IP were tested using the ATE (Automatic Test Equipment). Devices that passed the Bin1 criteria or met the Good standards during wafer sort ATE testing proceeded to the next FT (Final Test) stage. During this stage, the optical parameters of the laser were tested separately.
In the case of photoelectronic devices, both the Receiver (Rx) and Transmitter (Tx) were designed on a single wafer, serving as a shuttle wafer. Notably, the ATE test logic for Rx and Tx differed. To ensure precise positioning, we obtained the wafer map information for Rx and Tx within each reticle. Additionally, yield analysis and efforts to improve test time during production testing were carried out
The Result
Wafer Sort Success
Optimal Performance
95% Yield
